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首页> 外文期刊>IEEE Transactions on Electron Devices >Determination of energetic distribution of interface states between gate metal and semiconductor in sub-micron devices from current-voltage characteristics
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Determination of energetic distribution of interface states between gate metal and semiconductor in sub-micron devices from current-voltage characteristics

机译:从电流-电压特性确定亚微米器件中栅金属与半导体之间的界面态的能级分布

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摘要

Density and energetic distributions of interface states between metal-semiconductor rectifying contacts in sub-micron GaAs MESFET and AlGaAs/InGaAs pseudomorphic high electron mobility transistors (HEMT's) have been studied. Electrical properties of the interface states between gate metal and semiconductor in sub-micron devices depend on growth technique, associated processing parameters and surface states on III-V semiconductors. Correlation between nonideal current-voltage (I-V) characteristics and interface states has been established through the bias dependence of ideality factor. Ideality factor determined from I-V characteristics of MESFET and HEMT increases with bias and then decreases after reaching a maximum. A theoretical model based on nonequilibrium approach has been used to determine the density of interface states and their energetic distribution from ideality factor. Essentially, Fermi level shifts with applied bias and Schottky barrier height changes due to trapping and detrapping of electrons by the interface states, and from these changes, density of interface states and their energetic distributions have been determined.
机译:研究了亚微米GaAs MESFET和AlGaAs / InGaAs伪高电子迁移率晶体管(HEMT)中金属-半导体整流触点之间的界面态密度和能级分布。亚微米器件中栅极金属和半导体之间的界面状态的电学特性取决于生长技术,相关的工艺参数和III-V半导体上的表面状态。非理想电流-电压(I-V)特性与界面状态之间的相关性已通过理想因子的偏置依赖性建立。由MESFET和HEMT的I-V特性确定的理想因数随偏置而增加,然后在达到最大值后减小。基于非平衡方法的理论模型已被用来确定界面态的密度及其从理想因子的能量分布。本质上,由于界面态对电子的俘获和脱陷,费米能级随施加的偏压和肖特基势垒高度的变化而变化,并且从这些变化中,已经确定了界面态的密度及其能量分布。

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