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Semiconductor device and semiconductor circuit including the semiconductor device with enhanced current-voltage characteristics

机译:具有增强的电流-电压特性的半导体器件和包括该半导体器件的半导体电路

摘要

A semiconductor device is disclosed. The semiconductor device includes a substrate and a plurality of devices on the substrate, wherein a first device of the devices includes a first nitride semiconductor layer on the substrate, a second nitride semiconductor layer brought together with the first nitride semiconductor layer to form a first heterojunction interface, between the substrate and the first nitride semiconductor layer, a third nitride semiconductor layer brought together with the second nitride semiconductor layer to form a second heterojunction interface, between the substrate and the second nitride semiconductor layer, and a first contact electrically connected to the first and second heterojunction interfaces.
机译:公开了一种半导体器件。该半导体器件包括衬底和在衬底上的多个器件,其中器件中的第一器件包括在衬底上的第一氮化物半导体层,与第一氮化物半导体层结合在一起以形成第一异质结的第二氮化物半导体层。在衬底和第一氮化物半导体层之间的界面上,第三氮化物半导体层与第二氮化物半导体层一起形成第二异质结界面,在衬底和第二氮化物半导体层之间,并且第一触点电连接到衬底第一和第二异质结界面。

著录项

  • 公开/公告号US9825026B2

    专利类型

  • 公开/公告日2017-11-21

    原文格式PDF

  • 申请/专利权人 LG INNOTEK CO. LTD.;

    申请/专利号US201415100028

  • 发明设计人 JOHN TWYNAM;

    申请日2014-01-17

  • 分类号H01L29/778;H01L29/20;H01L27/06;H01L29/872;H01L27/085;H01L49/02;H01L29/205;H01L21/8252;

  • 国家 US

  • 入库时间 2022-08-21 12:55:23

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