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Reduced trapping effects and improved electrical performance in buried-gate 4H-SiC MESFETs

机译:降低埋入栅4H-SiC MESFET的俘获效应并改善电性能

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Surface effects on the current instability of 4H-SiC MESFETs were studied by comparing different surface structures. The current instability phenomenon was illustrated by bias sweeping methods and current recovery time measurements. A reduction in the current instability was observed for gate-recessed and buried-gate devices compared to the nonrecessed and channel-recessed devices. In addition, the buried-gate devices were found to have higher current density and breakdown voltage compared to the gate-recessed devices, resulting from their shorter effective gate length and lower electric field distribution under the gate, respectively. With high saturation current, high breakdown voltage, and much reduced surface effects, the buried-gate structure is a candidate for high-power SiC MESFETs.
机译:通过比较不同的表面结构,研究了表面效应对4H-SiC MESFET电流不稳定性的影响。通过偏置扫描法和电流恢复时间测量来说明电流不稳定性现象。与非凹入和沟道凹入的器件相比,观察到了栅极凹入和埋入式栅器件电流不稳定性的降低。另外,与埋入式栅器件相比,埋入式栅器件具有更高的电流密度和击穿电压,这分别是由于其有效栅长度较短和栅下电场较低。具有高饱和电流,高击穿电压和大大降低的表面效应,埋栅结构是大功率SiC MESFET的候选者。

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