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High Breakdown Voltage (>1000 V) Semi-Superjunction MOSFETs Using 600-V Class Superjunction MOSFET Process

机译:采用600V类超结MOSFET工艺的高击穿电压(> 1000 V)半超结MOSFET

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Si-MOSFETs with the breakdown voltage of over 1000 V were demonstrated, for the first time, realizing low on-re-sistance below the theoretical Si limit. The fabricated MOSFETs have a semi-superjunction (SemiSJ) structure, which is the combination of a superjunction (SJ) structure and an n-bottom assisted layer. The SemiSJ MOSFETs realize both the high breakdown voltage of 1110 and 1400 V and the low on-resistance of 54 and 163 mΩ cm{sup}2, respectively. The fabrication process for the high-voltage SemiSJ-MOSFET was completely equivalent to a 600-V class SJ-MOSFET process, which implies that a single optimized process for forming SJ structure for 600 V-class MOSFET can be used for a wide voltage range extending up to 1200 V MOSFET. Additionally the fabricated MOSFETs realized low K{sub}(on)Q{sub}(gd) of 4.6 ΩnC for a 1110-V device and 13.1 ΩnC for a 1400-V device, and recovery characteristics of the body diode were softer than those for the S J MOSFET. These results show the possibility of new Si power-MOSFET with a higher application voltage range.
机译:首次展示了击穿电压超过1000 V的Si-MOSFET,实现了低于理论Si极限的低导通电阻。所制造的MOSFET具有半超结(SemiSJ)结构,该结构是超结(SJ)结构和n底部辅助层的组合。 SemiSJ MOSFET分别实现了1110和1400 V的高击穿电压以及54和163mΩcm {sup} 2的低导通电阻。高压SemiSJ-MOSFET的制造工艺完全等同于600V类SJ-MOSFET工艺,这意味着用于600 V类MOSFET的SJ结构的单个优化工艺可用于宽电压范围扩展至1200 V MOSFET。此外,所制造的MOSFET对于1110-V器件实现了4.6ΩnC的低K {sub}(on)Q {sub}(gd),对于1400-V器件实现了13.1ΩnC,并且体二极管的恢复特性比那些柔和的用于SJ MOSFET。这些结果表明,具有更高应用电压范围的新型Si功率MOSFET的可能性。

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