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首页> 外文期刊>IEEE Transactions on Electron Devices >Experimental and Theoretical Investigations on Short-Channel Effects in 4H-SiC MOSFETs
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Experimental and Theoretical Investigations on Short-Channel Effects in 4H-SiC MOSFETs

机译:4H-SiC MOSFET的短沟道效应的实验和理论研究

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In this paper, a fundamental investigation on short-channel effects (SCEs) in 4H-SiC MOSFETs is given. Planar MOSFETs with various channel lengths have been fabricated on p-type 4H-SiC (0001), (0001) and (1120) faces. In the fabricated MOSFETs, SCEs such as punchthrough behavior, decrease of threshold voltage, deterioration of subthreshold characteristics, and saturation of transconductance occur by reducing channel length. The critical channel lengths below which SCEs occur are analyzed as a function of p-body doping and oxide thickness by using device simulation. The critical channel lengths obtained from the device simulation is in good agreement with the empirical relationship for Si MOSFETs. The critical channel lengths in the fabricated SiC MOSFETs are slightly longer than simulation results. The dependence of crystal face orientations on SCEs is hardly observed. Impacts of interface charge on the appearance of SCEs are discussed.
机译:本文对4H-SiC MOSFET中的短沟道效应(SCE)进行了基础研究。已在p型4H-SiC(0001),(0001)和(1120)面上制造了具有各种沟道长度的平面MOSFET。在制造的MOSFET中,通过减小沟道长度,会产生诸如击穿行为,阈值电压降低,亚阈值特性下降以及跨导饱和之类的SCE。通过使用器件仿真,分析了低于SCE的临界沟道长度,作为p体掺杂和氧化物厚度的函数。通过器件仿真获得的关键沟道长度与Si MOSFET的经验关系非常吻合。制成的SiC MOSFET的关键沟道长度比模拟结果稍长。几乎没有观察到晶面取向对SCE的依赖性。讨论了界面电荷对SCE外观的影响。

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