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A Study of Hot-Hole Injection During Programming Drain Disturb in Flash Memories

机译:闪存中编程漏扰过程中热孔注入的研究

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Program disturbs in NOR-type Flash arrays significantly degrade the tunnel oxide by hot-hole injection (HHI) induced by band-to-band tunneling at the drain overlap. This paper provides a comprehensive experimental and modeling analysis of HHI in Flash memories under program-disturb conditions. Carrier-separation measurements on arrays of Flash memories with contacted floating-gate (FG) allows for a direct investigation of hole-initiated impact ionization and HHI. A Monte Carlo (MC) model is used to simulate carrier multiplication and injection into the FG. After validating the MC model against experimental data for both secondary electron generation and HHI, the model is used to provide further insight into the hole-injection mechanism.
机译:NOR型闪存阵列中的编程干扰会由于漏极重叠处的带间隧道效应引起的热空穴注入(HHI)而大大降低隧道氧化物。本文提供了在程序扰动条件下闪存中HHI的综合实验和建模分析。带有接触式浮栅(FG)的闪存阵列的载流子分离测量可直接研究空穴引发的碰撞电离和HHI。蒙特卡洛(MC)模型用于模拟载波乘法和注入FG。在针对二次电子产生和HHI的实验数据验证了MC模型之后,该模型用于进一步洞悉空穴注入机理。

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