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off-State Current Limits of Narrow Bandgap MOSFETs

机译:窄带隙MOSFET的断态电流限制

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摘要

OFF-state current limitations of two types of MOSFETs, namely 1) flatband-mode MOSFET and 2) inversion-mode MOSFET, with narrow bandgap channel materials such as InSb, InAs, InGaAs, and Ge are discussed in conjunction with long-term requirements of the International Technology Roadmap for Semiconductors (ITRS). Flatband-mode high-mobility MOSFETs appear to be better suited for low off-state currents, in particular when a backside contact is used for minority carrier extraction. Based on off-state thermal minority carrier generation in narrow bandgap materials at room temperature, flatband MOSFETs with InSb channels appear to be applicable for high-performance logic and even low operating power requirements of the long-term ITRS; however, standby power requirements will demand InAs or channels of higher bandgap unless material and interface quality (and, thus, carrier lifetime) is substantially improved. The effects of drain-induced barrier lowering, band-to-band tunneling, impact ionization, and increased temperature on off-state currents are not considered here but may impose further restrictions
机译:结合长期需求,讨论了两种类型的MOSFET的截止状态电流限制,即1)窄带模式MOSFET和2)反向模式MOSFET,具有窄带隙沟道材料,例如InSb,InAs,InGaAs和Ge国际半导体技术路线图(ITRS)。扁平带模式高迁移率MOSFET似乎更适合于低关态电流,尤其是当背面接触用于少数载流子提取时。基于室温下窄带隙材料中的关闭状态热少数载流子产生,具有InSb沟道的平带MOSFET似乎适用于长期ITRS的高性能逻辑甚至更低的工作功率要求;但是,待机功率要求将要求InAs或更高的带隙通道,除非材料和接口质量(以及因此的载流子寿命)得到实质性改善。此处未考虑漏极引起的势垒降低,带间隧穿,碰撞电离和温度升高对截止态电流的影响,但可能会施加进一步的限制

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