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Hierarchical Simulation of Process Variations and Their Impact on Circuits and Systems: Methodology

机译:过程变化的分层模拟及其对电路和系统的影响:方法论

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Process variations increasingly challenge the manufacturability of advanced devices and the yield of integrated circuits. Technology computer-aided design (TCAD) has the potential to make key contributions to minimize this problem, by assessing the impact of certain variations on the device, circuit, and system. In this way, TCAD can provide the information necessary to decide on investments in the processing level or the adoption of a more variation tolerant process flow, device architecture, or design on circuit or chip level. In this first of two consecutive papers, sources of process variations and the state of the art of related simulation tools are reviewed. An approach for hierarchical simulation of process variations including their correlations is presented. The second paper, also published in this issue, presents examples of simulation results obtained with this methodology.
机译:工艺变化日益挑战先进设备的可制造性和集成电路的产量。通过评估某些变化对设备,电路和系统的影响,技术计算机辅助设计(TCAD)有潜力做出重要贡献,以最大程度地减少此问题。通过这种方式,TCAD可以提供必要的信息,以决定在处理级别上的投资或采用更具变化容忍性的流程,设备体系结构或电路或芯片级设计。在这两篇连续的论文中的第一篇中,回顾了过程变化的来源以及相关仿真工具的最新技术。提出了一种对过程变化进行分层仿真的方法,包括其相关性。在此问题上也发表的第二篇论文介绍了使用此方法获得的仿真结果的示例。

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