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Device Characteristics and Equivalent Circuits for NMOS Gate-to-Drain Soft and Hard Breakdown in Polysilicon/SiON Gate Stacks

机译:多晶硅/ SiON栅极叠层中NMOS栅极至漏极软击穿和硬击穿的器件特性和等效电路

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摘要

In state-of-the-art technologies, the currents in all n-channel field-effect transistor device terminals can be severely degraded when a soft or hard dielectric breakdown event occurs from gate-to-drain. The equivalent circuits that are commonly used for modeling gate-to-drain breakdown do not adequately capture all of the salient features of post breakdown device characteristics and can yield results that are overly optimistic. We present an equivalent circuit comprehending both soft and hard breakdown that can be used to accurately model gate, drain, and source currents following a breakdown event from gate-to-drain.
机译:在最新技术中,当从栅极到漏极发生软或硬介电击穿事件时,所有n沟道场效应晶体管器件端子中的电流都会严重降低。通常用于对栅极到漏极击穿进行建模的等效电路不能充分捕获击穿后器件特性的所有显着特征,并且会产生过于乐观的结果。我们提出了一种包含软击穿和硬击穿的等效电路,可用于对栅极到漏极击穿事件之后的栅极,漏极和源极电流进行精确建模。

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