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Modeling of Threshold-Voltage Drift in Phase-Change Memory (PCM) Devices

机译:相变存储器(PCM)器件中的阈值电压漂移建模

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The amorphous phase of the chalcogenide material in phase-change memory (PCM) devices is sensitive to temperature-activated crystallization and structural relaxation (SR). The latter leads to a change of device/material properties, such as the mobility band gap, the resistance, and the threshold voltage $V_{T}$ for threshold switching. In this paper, we present a $V_{T}$ drift model based on physical descriptions of the electrical transport, the threshold switching, and the SR. We introduce an analytical formula describing the relation between the drift slopes of resistance and $V_{T}$ via the subthreshold slope STS of the $I$– $V$ curve. A numerical model predicting the time evolution of $V_{T}$ for different programmed states in the PCM multilevel cell is finally presented and compared with experiments.
机译:相变存储(PCM)器件中硫族化物材料的非晶相对温度激活的结晶和结构弛豫(SR)敏感。后者导致器件/材料特性的变化,例如迁移率带隙,电阻和用于阈值切换的阈值电压$ V_ {T} $。在本文中,我们基于电传输,阈值切换和SR的物理描述提出了一个$ V_ {T} $漂移模型。我们引入一个解析公式,该公式通过$ I $ – $ V $曲线的亚阈值斜率STS描述电阻和$ V_ {T} $的漂移斜率之间的关系。最后,给出了预测PCM多级单元中不同编程状态$ V_ {T} $的时间演化的数值模型,并将其与实验进行了比较。

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