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AlGaN/GaN Three-Terminal Junction Devices for Rectification and Transistor Applications on 3C-SiC/Si Pseudosubstrates

机译:用于3C-SiC / Si伪衬底上的整流和晶体管应用的AlGaN / GaN三端结器件

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摘要

AlGaN/GaN heterosystems with their two dimensional electron gas at the interface enable high-mobility transistor devices. We present a technology for high-mobility three-terminal junction (TTJ) devices on 3C-SiC(111)/Si(111) pseudosubstrates. Those devices that allow multipurpose applications are determined by only slight variations in their geometrical properties such as side gate transistor behavior besides positive and negative type rectifications on a single chip based on AlGaN/GaN heterostructures grown on silicon substrates using a SiC transition layer. In this paper, we present the technological process and the nonlinear electrical properties of TTJ devices using Si basic substrates with room temperature electron mobility up to 1680 ${rm cm}^{2}/{rm V~s}$. Narrow and wide bar types of rectifying devices with T and Y type active regions are shown as well as side gate transistors with a transconductance of 20 mS/mm and an output conductance of 600 mS/mm. The TTJ active region withstands fields ${>}{rm 1.5}~{rm MV/cm}$.
机译:在界面处具有二维电子气的AlGaN / GaN异质系统可实现高迁移率晶体管器件。我们提出了一种用于3C-SiC(111)/ Si(111)伪衬底上的高迁移率三端子结(TTJ)器件的技术。那些允许多用途应用的器件仅由其几何特性(如侧栅晶体管的行为)的微小变化决定,除了基于在单个衬底上使用SiC过渡层生长在硅衬底上的AlGaN / GaN异质结构的单个芯片上的正负型整流之外。在本文中,我们介绍了使用具有室温电子迁移率高达1680的Si基本衬底的TTJ器件的工艺过程和非线性电学特性。<公式公式类型=“ inline”> $ {rm cm} ^ {2} / {rm V〜s} $ 。示出了具有T和Y型有源区的窄条和宽条型整流装置以及具有20mS / mm的跨导和600mS / mm的输出电导的侧栅晶体管。 TTJ活动区域可以承受 $ {>} {rm 1.5}〜{rm MV / cm} $ 字段。

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