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Fabrication and Characterization of High-Mobility Solution-Based Chalcogenide Thin-Film Transistors

机译:基于高迁移率溶液的硫族化物薄膜晶体管的制备与表征

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摘要

We report device and material considerations for the fabrication of high-mobility thin-film transistors (TFTs) compatible with large-area and inexpensive processes. In particular, this paper reports photolithographically defined n-type TFTs (n-TFTs) based on cadmium sulfide (CdS) films deposited using solution-based techniques. The integration process consists of four mask levels with a maximum processing temperature of 100 $^{circ}hbox{C}$. The TFT performance was analyzed in terms of the CdS semiconductor thickness and as a function of postdeposition annealing in a reducing ambient. The $I_{rm on}/I_{rm off}$ ratios are $sim!! hbox{10}^{7}$ with field-effect mobilities of $ sim$5.3 and $sim!hbox{4.7} hbox{cm}^{2}/hbox{V}cdot hbox{s}$ for Al and Au source–drain contacts, respectively, using 70 nm of CdS. Transmission electron microscopy and electron energy loss spectroscopy were used to analyze the CdS–metal interfaces.
机译:我们报告了与大面积,廉价工艺兼容的高迁移率薄膜晶体管(TFT)的制造过程中的设备和材料注意事项。特别是,本文报道了使用基于溶液的技术沉积的基于硫化镉(CdS)膜的光刻定义的n型TFT(n-TFT)。集成过程由四个掩模层组成,其最高处理温度为100 $ ^ circbox {C} $。根据CdS半导体厚度以及在降低的环境中进行后沉积退火的功能来分析TFT性能。 $ I_ {rm on} / I_ {rm off} $的比率为$ sim! hbox {10} ^ {7} $,具有$ sim $ 5.3和$ sim!的场效应迁移率。hbox {4.7} hbox {cm} ^ {2} / hbox {V} cdot hbox {s} $用于铝和金–使用70 nm的CdS分别排泄触点。透射电子显微镜和电子能量损失谱用于分析CdS-金属界面。

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