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Predictive Simulation and Benchmarking of Si and Ge pMOS FinFETs for Future CMOS Technology

机译:用于未来CMOS技术的Si和Ge pMOS FinFET的预测仿真和基准测试

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摘要

In this paper, we study and compare Si versus Ge pMOS FinFETs at advanced node dimensions using ensemble Monte Carlo simulations. It is found that due to large external resistance, lack of stressing methods, smaller bandgap, larger dielectric constant, and increased variability that in the absence of major innovation, Ge is not an ideal candidate for channel replacement material of pMOS in future CMOS technology generation FinFETs. In order for Ge to compete with Si, it would at a minimum require a stressing mechanism and improved contact resistance, but leakage and variability would still be a concern for low-power applications.
机译:在本文中,我们使用集成蒙特卡洛模拟研究和比较了高级节点尺寸的Si与Ge pMOS FinFET。发现由于大的外部电阻,缺乏应力方法,较小的带隙,较大的介电常数以及可变性增加,在缺乏重大创新的情况下,Ge并不是未来CMOS技术中pMOS的沟道替代材料的理想选择。 FinFET。为了使Ge与Si竞争,它至少需要一种应力机制和改进的接触电阻,但是对于低功率应用,泄漏和可变性仍然是一个问题。

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