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Benchmarks of a III-V TFET technology platform against the 10-nm CMOS FinFET technology node considering basic arithmetic circuits

机译:考虑基本算术电路的III-V TFET技术平台针对10-nm CMOS FinFET技术节点的基准测试

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摘要

In this work, a benchmark for low-power digital applications of a III-V TFET technology platform against a conventional CMOS FinFET technology node is proposed. The analysis focuses on full-adder circuits, which are commonly identified as representative of the digital logic environment. 28T and 24T topologies, implemented in complementary-logic and transmission-gate logic, respectively, are investigated. Transient simulations are performed with a purpose-built test-bench on each single-bit full adder solution. The extracted delays and energy characteristics are post-processed and translated into figures-of merit for multi-bit ripple-carry-adders. Trends related to the different full-adder implementations (for the same device technology platform) and to the different technology platforms (for the same full adder topology) are presented and discussed. (C) 2016 Elsevier Ltd. All rights reserved.
机译:在这项工作中,提出了针对III-V TFET技术平台的低功率数字应用相对于常规CMOS FinFET技术节点的基准。分析的重点是全加法器电路,该电路通常被认为是数字逻辑环境的代表。研究了分别以互补逻辑和传输门逻辑实现的28T和24T拓扑。瞬态仿真是在每个单位完全加法器解决方案上使用专用的测试平台进行的。提取的延迟和能量特性经过后处理,并转化为多位脉动进位加法器的品质因数。提出并讨论了与不同的全加器实现(对于同一设备技术平台)和不同的技术平台(对于相同的全加器拓扑结构)有关的趋势。 (C)2016 Elsevier Ltd.保留所有权利。

著录项

  • 来源
    《Solid-State Electronics》 |2017年第2期|37-42|共6页
  • 作者单位

    Univ Udine, DPIA, Via Sci 206, I-33100 Udine, Italy;

    Univ Udine, DPIA, Via Sci 206, I-33100 Udine, Italy;

    Univ Calabria, DIMES, Via P Bucci,41C, I-87036 Arcavacata Di Rende, CS, Italy;

    Univ Udine, DPIA, Via Sci 206, I-33100 Udine, Italy;

    Univ Calabria, DIMES, Via P Bucci,41C, I-87036 Arcavacata Di Rende, CS, Italy;

    Univ Udine, DPIA, Via Sci 206, I-33100 Udine, Italy;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    III-V; TFET; Full adders; Ripple carry adders;

    机译:III-V;TFET;全加法器;纹波加法器;

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