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Device and Circuit Interaction Analysis of Stochastic Behaviors in Cross-Point RRAM Arrays

机译:交叉点RRAM阵列中随机行为的器件和电路相互作用分析

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摘要

Stochastic behaviors of resistive random access memory (RRAM) play an important role in the design of cross-point memory arrays. A Monte Carlo (MC) compact model of oxide RRAM is developed and calibrated with experiments on various device stack configurations. With MC SPICE simulations, we show that an increase in array size and interconnect wire resistance will statistically deteriorate write functionality. Write failure probability (WFP) has an exponential dependence on device uniformity and supply voltage (VDD), and the array bias scheme is a key knob. Lowering array VDD leads to higher effective energy consumption (EEC) due to the increase in WFP when the variation statistics are included in the analysis. Random access simulations indicate that data sparsity statistically benefit write functionality and energy consumption. Finally, we show that a pseudo-subarray topology with uniformly distributed preforming cells in the pristine high-resistance state is able to reduce both WFP and EEC, enabling higher net capacity for memory circuits due to improved variation tolerance.
机译:电阻性随机存取存储器(RRAM)的随机行为在交叉点存储器阵列的设计中起着重要作用。开发了氧化物RRAM的蒙特卡罗(MC)紧凑模型,并通过各种器件堆栈配置的实验进行了校准。通过MC SPICE仿真,我们显示出阵列尺寸和互连线​​电阻的增加将在统计上降低写入功能。写失败概率(WFP)与器件均匀性和电源电压(V DD )呈指数关系,而阵列偏置方案是关键。降低阵列V DD 会导致较高的有效能耗(EEC),这是由于在分析中包括了变化统计量后WFP的增加。随机访问模拟表明,数据稀疏性在统计上有利于写功能和能耗。最后,我们表明,在原始高电阻状态下具有均匀分布的预成型单元的伪子阵列拓扑能够降低WFP和EEC,由于提高了变化容限,因此能够为存储电路提供更高的净容量。

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