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Analytical Model to Estimate FinFET’s ION , IOFF , SS, and VT Distribution Due to FER

机译:估算由于FER而导致FinFET的ION,IOFF,SS和VT分布的分析模型

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In our earlier work, we presented a percolation theory-based analytical model to estimate FinFET’s VT distribution due to fin edge roughness. The earlier models in the literature were based on minimum fin width, the limitations of which were discussed in detail. In this paper, we advance the percolation theory-based model to capture the variability in all key-device parameters, viz. ION , IOFF , subthreshold slope, and VT . The entire distribution of these parameters obtained by the model is presented and compared against stochastic TCAD to demonstrate excellent match. The model reduces rms error in μ of various parameters by 5%–60%, and 20%–50% in σ with respect to the minimum fin width-based models present in the literature.
机译:在我们早期的工作中,我们提出了基于渗流理论的分析模型,以估算由于鳍边缘粗糙度而导致FinFET的VT分布。文献中较早的模型基于最小鳍片宽度,并详细讨论了其限制。在本文中,我们提出了基于渗流理论的模型,以捕获所有关键设备参数的可变性。 ION,IOFF,亚阈值斜率和VT。呈现了模型获得的这些参数的完整分布,并与随机TCAD进行了比较,以显示出色的匹配性。与文献中基于最小翅片宽度的模型相比,该模型可将各种参数的μ均方根误差降低5%–60%,将σ的均方根误差降低20%–50%。

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