机译:基于SPICE模型的负电容铁电MOSFET的延迟和功率评估
Department of Electrical and Computer Engineering, National University of Singapore, Singapore;
Agency for Science, Technology and Research, Institute of Materials Research and Engineering, Singapore;
Department of Electrical and Computer Engineering, National University of Singapore, Singapore;
Iron; Integrated circuit modeling; MOSFET; Semiconductor device modeling; Logic gates; Mathematical model; SPICE;
机译:基于SPICE的多体性模型分析铁电负电容 - 静电MEMS混合动力致动器的动态
机译:评估模拟电路应用中的负电容铁电MOSFET
机译:基于超薄体硅和单层MOS2的负电容MOSFET的性能评估与装置物理研究
机译:负电容FET的器件结构效应,SPICE建模和电路评估
机译:建模平面和非平面MOSFET的外部电阻和电容
机译:具有位置载流子散射相关性的准弹道漏电流电荷和电容模型对纳米级对称DG MOSFET有效
机译:负电容MOSFET的铁电性能的设计考虑因素
机译:用于功率mOsFET的温度相关spICE宏模型