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Impact of Equivalent Oxide Thickness on Threshold Voltage Variation Induced by Work-Function Variation in Multigate Devices

机译:等效氧化物厚度对多栅极器件中功函数变化引起的阈值电压变化的影响

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摘要

Using 3-D technology computer aided design simulation, we investigated the impact of equivalent oxide thickness (EOT) on threshold voltage (VTH) variation induced by work-function variation (WFV) in multigate devices. The WFV-induced VTH variation in multigate devices does not significantly vary with the dielectric constant of the gate dielectric material, but increases with decreasing physical oxide thickness (TOX). As TOX becomes thinner, electric field tends to be locally concentrated, causing a large variation of electrostatic potential in channel. The slope of the ratio of average grain size to gate area (RGG) plot is observed with various oxide thicknesses. It is confirmed that we can alleviate the WFV-induced VTH variation without significant performance degradation if gate dielectric layer becomes thicker with appropriately adopted higher-k engineering. In addition, the impact of EOT (including interface layer) on the WFV-induced VTH variation is studied.
机译:使用3-D技术计算机辅助设计仿真,我们研究了等效氧化物厚度(EOT)对多栅极器件中由功函数变化(WFV)引起的阈值电压(VTH)变化的影响。多栅极器件中由WFV引起的VTH变化不会随栅极电介质材料的介电常数显着变化,但会随着物理氧化物厚度(TOX)的减小而增加。随着TOX变薄,电场趋于局部集中,从而导致通道中静电势的较大变化。在不同的氧化物厚度下,可以观察到平均晶粒尺寸与浇口面积(RGG)的比值的斜率。可以肯定的是,如果采用适当采用的高k技术使栅极介电层变厚,我们可以缓解WFV引起的VTH变化,而不会显着降低性能。此外,还研究了EOT(包括界面层)对WFV引起的VTH变化的影响。

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