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Quasi-Analytical Model of 3-D Vertical-RRAM Array Architecture for MB-Level Design

机译:MB级设计的3-D垂直RRAM阵列架构的准分析模型

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摘要

This paper addresses the design challenges of simulating the 3-D vertical-resistive random access memory (V-RRAM) toward MB-level. The interconnect IR drop and sneak paths are known to be the limiting factors for building large-scale V-RRAM arrays. The previous approach to evaluate the write/read margin of V-RRAM was based on the exhaustive SPICE simulations, which prohibits the design exploration to MB-level as it takes huge amount of computation resources. In this paper, a quasi-analytical model is proposed, which aims to reduce the simulation time and the required memory usage. Through the validation with the SPICE simulation results, the proposed model shows a similar accuracy. Based on the proposed quasi-analytical model, the worst case data pattern of 3-D V-RRAM with large array size up to 4 MB is analyzed. The results show that it is more efficient to increase the number of stack layers than expanding the horizontal array size to achieve large subarray size.
机译:本文解决了在MB级上模拟3-D垂直电阻型随机存取存储器(V-RRAM)的设计挑战。已知互连IR下降和潜行路径是构建大规模V-RRAM阵列的限制因素。先前评估V-RRAM的写入/读取余量的方法是基于详尽的SPICE仿真,因为它占用大量计算资源,因此无法将设计探索到MB级别。本文提出了一种准分析模型,旨在减少仿真时间和所需的内存使用量。通过对SPICE仿真结果的验证,所提出的模型显示出相似的准确性。基于所提出的准分析模型,分析了具有高达4 MB的大阵列大小的3-D V-RRAM的最坏情况数据模式。结果表明,增加堆栈层数比扩展水平阵列大小以实现较大的子阵列大小更有效。

著录项

  • 来源
    《IEEE Transactions on Electron Devices》 |2017年第4期|1568-1574|共7页
  • 作者单位

    College of Electronic Science and Engineering, National University of Defense Technology, Changsha, China;

    School of Electrical, Computer and Energy Engineering, Arizona State University, Tempe, AZ, USA;

    College of Electronic Science and Engineering, National University of Defense Technology, Changsha, China;

    College of Electronic Science and Engineering, National University of Defense Technology, Changsha, China;

    College of Electronic Science and Engineering, National University of Defense Technology, Changsha, China;

    School of Electrical, Computer and Energy Engineering, Arizona State University, Tempe, AZ, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Resistance; Computer architecture; Integrated circuit modeling; Solid modeling; Computational modeling; Microprocessors; Electrodes;

    机译:电阻;计算机体系结构;集成电路建模;实体建模;计算建模;微处理器;电极;

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