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Improved Interfacial and Electrical Properties of GaAs MOS Capacitor With LaON/TiON Multilayer Composite Gate Dielectric and LaON as Interfacial Passivation Layer

机译:以LaON / TiON多层复合栅电介质和LaON作为界面钝化层的GaAs MOS电容器的界面和电学性能的改善

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GaAs metal-oxide-semiconductor capacitors are fabricated by alternately depositing La oxynitride (LaON)/TiON or TiON/LaON or first depositing a LaON interlayer and then alternately depositing LaON/TiON, and their interfacial and electrical properties are investigated and compared. Experimental results show that the sample with LaON interlayer exhibits better interface quality and electrical performance than the other two samples: lower interface-state density (1.05×1012 cm-2 eV-1), smaller gate leakage current (2.33 × 10-5 A/cm2 at Vfb + 1 V), larger equivalent dielectric constant (25.3), and better high-field reliability. The involved mechanism lies in the fact that the LaON interlayer on the GaAs surface can effectively reduce the defective states atear the interface by blocking the Ti/O in-diffusion and As/Ga out-diffusion, thus improving the interfacial and electrical properties of the device.
机译:通过交替沉积氮氧化镧(LaON)/ TiON或TiON / LaON或先沉积LaON中间层,然后交替沉积LaON / TiON来制造GaAs金属氧化物半导体电容器,并对其界面和电学性能进行了比较。实验结果表明,具有LaON中间层的样品比其他两个样品具有更好的界面质量和电性能:较低的界面态密度(1.05×1012 cm-2 eV-1),较小的栅极泄漏电流(2.33×10-5 A) / cm2(在Vfb +1 V时),更大的等效介电常数(25.3)和更好的高场可靠性。所涉及的机理在于,GaAs表面上的LaON中间层可以通过阻止Ti / O的内扩散和As / Ga的外扩散来有效减少界面处/界面附近的缺陷态,从而改善界面和电学性质。设备的

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