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Analysis and Modeling of Cross-Coupling and Substrate Capacitances in GaN HEMTs for Power-Electronic Applications

机译:GaN HEMT中用于电力电子应用的交叉耦合和衬底电容的分析和建模

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摘要

In this paper, we present a capacitance model for field-plate AlGaN/GaN High Electron Mobility Transistor (HEMTs) accounting for the contribution of substrate capacitances and cross-coupling between field plates. TCAD simulations are performed to analyze both these contributions and analytical expressions for charges corresponding to the cross-coupling and substrate capacitances are presented in terms of our existing surface-potential-based model. The modeled results are validated by comparing the time-domain waveforms of a test circuit using a mixed-mode simulation setup in which the impact of cross-coupling and substrate capacitances on accuracy of switching transients predicted by the model is discussed.
机译:在本文中,我们提出了场板AlGaN / GaN高电子迁移率晶体管(HEMT)的电容模型,其中考虑了基板电容的贡献以及场板之间的交叉耦合。进行TCAD仿真以分析这些贡献,并根据我们现有的基于表面电势的模型介绍了与交叉耦合相对应的电荷的解析表达式,并给出了衬底电容。通过使用混合模式仿真设置比较测试电路的时域波形来验证建模结果,其中讨论了交叉耦合和衬底电容对模型预测的开关瞬态精度的影响。

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