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Extraction of Compact Static Thermal Model Parameters for SiGe HBTs

机译:SiGE HBTS的紧凑型静态热模型参数提取

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In this article, we present and evaluate compact static thermal model parameter extraction techniques for modern silicon germanium heterojunction bipolar transistors (SiGe HBTs). We found that the model implementation of thermal resistance ( ${R}_{ext {th}}$ ) based on only junction temperature is implicit requiring time-consuming iterative procedure which may lead to potential instabilities. Dedicated extraction techniques are proposed for obtaining compact model-specific ${R}_{ext {th}}$ and its temperature coefficient. The proposed method is primarily validated on SPICE generated synthetic data. Next in order to showcase a compact model-independent verification, we also test the method using detailed thermal simulation from TCAD. Finally, we apply our extraction technique on measured data from fabricated transistors. The results are benchmarked to already obtained nominal ${R}_{ext {th}}$ values from the same device family.
机译:在本文中,我们展示并评估了现代硅锗异质结双极晶体管(SiGe Hbts)的紧凑型静态热模型参数提取技术。我们发现,热阻的模型实现(<内联 - 公式XMLNS:MML =“http://www.w3.org/1998/math/mathml”xmlns:xlink =“http://www.w3.org/ 1999 / xlink“> $ {r} _ { text {th}} $ )基于仅结温是隐含的时间 - 用于可能导致潜在不稳定性的迭代程序。提出了专用的提取技术,用于获取Complace Model特定于特定于Complic型号<内联公式XMLNS:MML =“http://www.w3.org/1998/math/mathml”xmlns:xlink =“http://www.w3.org / 1999 / xlink“> $ {r} _ { text {th}} $ 及其温度系数。所提出的方法主要验证Spice生成的合成数据。接下来为了展示紧凑的模型验证,我们还测试了使用TCAD的详细热模拟的方法。最后,我们在来自制造晶体管的测量数据上应用了我们的提取技术。结果是基准测试到已获得标称<内联公式XMLNS:MML =“http://www.w3.org/1998/math/mathml”xmlns:xlink =“http://www.w3.org/1999/ xlink“> $ {r} _ { text {th}} $ 来自同一设备系列的值。

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