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Memory-Logic Hybrid Gate With 3-D Stackable Complementary Latches

机译:具有3-D可堆叠互补闩锁的内存逻辑混合栅极

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摘要

In this article, a single-layer complementary latch (CL) and one multilayer CL which are fully compatible with standard FinFET CMOS processes are characterized and their applications are extensively discussed. Through the complementary pair with the 3-D stackable twin-bit resistive random-access memory (RRAM) which consists of a TaON-based resistive film, the CLs feature great area efficiency and stable output responses. By measurement, the characteristics of the 3-D stackable twin-bit RRAM are discussed. Besides, the power, output voltage distribution, and data restoration time of the CLs are analyzed and compared.
机译:在本文中,特征在于与标准FinFET CMOS工艺完全兼容的单层互补锁存器(CL)和一个多层CL,并且它们的应用被广泛讨论。通过与三维堆叠双钻头电阻随机存取存储器(RRAM)的互补对,该存储器(RRAM)由基于陶基电阻膜组成,CLS具有很大的区域效率和稳定的输出响应。通过测量,讨论了3-D可堆叠双位RRAM的特性。此外,分析了CLS的电源,输出电压分布和数据恢复时间。

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