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Impact of Transport Anisotropy on the Performance of van der Waals Materials-Based Electron Devices

机译:运输各向异性对van der WALS材料的电子设备的影响

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Layered van der Waals (vdW) semiconductors have emerged as preferred materials for building next-generation electronic devices, such as diodes and field-effect transistors (FETs), because of their capability of providing high mobility at the nanometer-scale thickness, as well as their flexibility and pristine interfaces. However, the inherent "vdW gaps" in these materials lead to much larger cross-plane resistivity, with respect to in-plane resistivity, thereby forming intriguing transport anisotropy. In this article, using extensive numerical simulations, it is found that this anisotropy introduces anomalous current transport behavior in vdW-based electron devices in which the current conducts in both the in-plane and cross-plane directions, including stacked heterojunction diodes and thin-film transistors (TFTs). Our study reveals for the first time that transport anisotropy degrades the performance of these devices, especially when devices are scaled (<0.6 mu m) and/or relatively thicker materials (>4 nm) are used. Potential solutions to alleviate degradation are discussed as well.
机译:层叠的范德瓦尔斯(VDW)半导体已成为建立下一代电子设备的优选材料,例如二极管和场效应晶体管(FET),因为它们的能力也在纳米尺度厚度下提供高迁移率,以及作为它们的灵活性和原始界面。然而,这些材料中固有的“VDW间隙”导致相对于面内电阻率的平面电阻率大得多,从而形成有兴趣传输各向异性。在本文中,发现该各向异性在基于VDW的电子器件中引入了基于VDW的电子器件中的异常电流传输行为,其中电流在面内和平面方向上,包括堆叠的异质结二极管和薄 - 薄膜晶体管(TFT)。我们的研究首次揭示了运输各向异性的第一次降低了这些装置的性能,尤其是当使用装置缩放(<0.6μm)和/或相对较厚的材料(> 4nm)时。还讨论了缓解降解的潜在解决方案。

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