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Compositionally Graded III-N HEMTs for Improved Linearity: A Simulation Study

机译:用于改进线性度的成分分级III-N HEMT:仿真研究

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As is well known, a roadblock to realizing the full potential of GaN high-electron mobility transistors (HEMTs) for power amplifier applications is the peaked nature of the transconductance and the resulting power-gain roll-off exhibited by these devices. Motivated by promising work on compositionally graded HEMT designs, in this paper we explore this design solution using the numerical device simulation. Among other things, we examine the consequences of saturation velocity, grading profile, alloy scattering, and device scaling. In addition, lumped element modeling of the large-signal behavior is carried out to assess the power amplifier performance. We also compare the graded approach with another known method of linearity improvement in which the source resistance is reduced. In general, we find much to recommend in the graded-channel approach, especially for gate lengths greater than about 100 nm.
机译:众所周知,实现功率放大器应用中的GaN高电子迁移率晶体管(HEMT)的全部潜力的障碍是跨导的峰值特性,以及这些器件所表现出的功率增益下降。受成分分级HEMT设计方面有希望的工作的激励,本文中,我们使用数值设备仿真来探索该设计解决方案。除其他外,我们检查了饱和速度,梯度分布,合金散射和器件结垢的后果。此外,还对大信号行为的集总元件建模进行了评估,以评估功率放大器的性能。我们还将分级方法与另一种已知的线性改进方法进行了比较,在这种方法中,降低了源电阻。通常,在梯度通道方法中,我们发现很多建议,尤其是对于大于约100 nm的栅极长度。

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