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Investigation of the soft-write mechanism in source-side injection flash EEPROM devices

机译:源侧注入闪存EEPROM器件的软写入机制研究

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摘要

The soft-write effect which occurs when reading the content of a source-side injection (SSI) flash EEPROM cell has been identified and thoroughly investigated. This effect is caused by an electron injection mechanism which has the same physical origin as the enhanced (or source-side) hot-electron injection that is used for fast flash EEPROM programming. A procedure for the prediction of the associated soft-write lifetime is proposed, subsequently applied to a state-of-the-art split-gate SSI cell, and found to be noncritical for a reliable device operation. Therefore, source and drain do not have to be interchanged during the read-out operation with respect to the programming operation, and the traditional forward read-out scheme can be maintained for SSI flash memories.
机译:已经识别并彻底研究了在读取源侧注入(SSI)快闪EEPROM单元的内容时发生的软写效应。此效应是由电子注入机制引起的,该电子注入机制的物理起源与用于快速闪存EEPROM编程的增强型(或源侧)热电子注入相同。提出了用于预测相关联的软写寿命的过程,随后将该过程应用于最新的分裂栅SSI单元,并且发现对于可靠的设备操作而言这不是关键性的。因此,在读出操作期间不必相对于编程操作互换源极和漏极,并且可以为SSI闪存保持传统的正向读出方案。

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