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P-type 4H and 6H-SiC high-voltage Schottky barrier diodes

机译:P型4H和6H-SiC高压肖特基势垒二极管

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High-voltage Schottky barrier diodes have been successfully fabricated for the first time on p-type 4H- and 6H-SiC using Ti as the barrier metal. Good rectification was confirmed at temperatures as high as 250/spl deg/C. The barrier heights were estimated to be 1.8-2.0 eV for 6H-SiC and 1.1-1.5 eV for 4H-SiC at room temperature using both I-V and C-V measurements. The specific on resistance (R/sub on,sp/) for 4H- and 6H-SiC were found to be 25 m/spl Omega/ cm/sup -2/ and 70 m/spl Omega/ cm/sup -2/ at room temperature. A monotonic decrease in resistance occurs with increasing temperature for both polytypes due to increased ionization of dopants. An analytical model is presented to explain the decrease of R/sub on,sp/ with temperature for both 4H and 6H-SiC which fits the experimental data. Critical electric field strength for breakdown was extracted for the first time in both p-type 4H and 6H-SiC using the breakdown voltage and was found to be 2.9/spl times/10/sup 6/ V/cm and 3.3/spl times/10/sup 6/ V/cm, respectively. The breakdown voltage remained fairly constant with temperature for 4H-SiC while it was found to decrease with temperature for 6H-SiC.
机译:高压肖特基势垒二极管首次成功地使用Ti作为势垒金属在p型4H-和6H-SiC上制造。在高达250 / spl deg / C的温度下,确认了良好的精馏。使用I-V和C-V测量,室温下6H-SiC的势垒高度估计为1.8-2.0 eV,4H-SiC的势垒高度估计为1.1-1.5 eV。发现4H-SiC和6H-SiC的比电阻(R / sub on,sp /)为25 m / spl Omega / cm / sup -2 /和70 m / spl Omega / cm / sup -2 /室内温度。由于掺杂剂的电离增加,两种多型体的电阻均随温度升高而单调降低。提出了一个解析模型来解释4H和6H-SiC的R / sub on,sp /随温度的降低,这与实验数据吻合。使用击穿电压首次在p型4H和6H-SiC中提取了击穿的临界电场强度,发现其为2.9 / spl次/ 10 / sup 6 / V / cm和3.3 / spl次/ 10 / sup 6 / V / cm。对于4H-SiC,击穿电压随温度保持相当恒定,而对于6H-SiC,其击穿电压随温度降低。

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