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Significantly improved performance of MOSFETs on silicon carbide using the 15R-SiC polytype

机译:使用15R-SiC多型体显着提高了碳化硅上MOSFET的性能

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Recent studies regarding MOSFETs on SiC reveal that 4H-SiC devices suffer from a low inversion layer mobility, while in 6H-SiC, despite a higher channel mobility the bulk mobility parallel to the c-axis is too low, making this polytype unattractive for power devices. This work presents experimental mobility data of MOSFETs fabricated on different polytypes as well as capacitance-voltage (C-V) measurements of corresponding n-type MOS structures which give evidence that the low inversion channel mobility in 4H-SiC is caused by a high density of SiC-SiO/sub 2/ interface states close to the conduction band. These defects are believed to be inherent to all SiC polytypes and energetically pinned at around 2.9 eV above the valence band edge. Thus, for polytypes with band gaps smaller than 4H-SiC like 6H-SiC and 15R-SiC, the majority of these states will become resonant with the conduction band at room temperature or above, thus remarkably suppressing their negative effect on the channel mobility. In order to realize high performance power MOSFETs the results reveal that 15R-SiC is the best candidate among all currently accessible SiC polytypes.
机译:关于SiC上MOSFET的最新研究表明,4H-SiC器件的反型层迁移率较低,而在6H-SiC中,尽管沟道迁移率较高,但平行于c轴的体迁移率却太低,使得该多型体对功率没有吸引力设备。这项工作提出了在不同多型上制造的MOSFET的实验迁移率数据,以及相应n型MOS结构的电容电压(CV)测量,这些证据表明4H-SiC中的低反向沟道迁移率是由SiC的高密度引起的-SiO / sub 2 /界面状态接近导带。这些缺陷被认为是所有SiC多晶型所固有的,并且在价带边缘上方约2.9 eV处被强力钉扎。因此,对于像6H-SiC和15R-SiC这样的带隙小于4H-SiC的多型体,这些状态中的大多数将在室温或更高温度下与导带共振,从而显着抑制了它们对沟道迁移率的负面影响。为了实现高性能功率MOSFET,结果表明15R-SiC是所有当前可访问的SiC多型中的最佳候选。

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