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Enhancement of PMOS device performance with poly-SiGe gate

机译:多晶硅栅极增强PMOS器件性能

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Poly-Si and poly-Si/sub 0.75/Ge/sub 0.25/-gated PMOS transistors with a very thin gate oxide of 29 /spl Aring/ were fabricated. In addition to reduced gate-depletion effect (GDE) and reduced boron penetration, more favorable I/sub d/-V/sub d/ characteristics were observed for the poly-SiGe-gated transistors than poly-Si-gated transistors. This and the underlying superior hole mobility are explained with a universal mobility model based on V/sub g/, T/sub ox/, V/sub th/ and V/sub th/. Both reduced GDE and superior hole mobility contribute to the enhanced performance.
机译:制备了具有非常薄的栅氧化层29 / spl Aring /的多晶硅和多晶硅/sub-0.75/Ge/sub-0.25/门控型PMOS晶体管。除了减少的栅极耗尽效应(GDE)和减少的硼渗透之外,对于多晶硅栅栅极晶体管,还观察到了比多晶硅栅栅极晶体管更有利的I / sub d / -V / sub d /特性。使用基于V / sub g /,T / sub ox /,V / sub th /和V / sub th /的通用迁移率模型解释了这一点以及潜在的优越的空穴迁移率。降低的GDE和出色的空穴迁移率都有助于提高性能。

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