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Hole Energy Dependent Interface Trap Generation in MOSFET Si/SiO{sub}2 Interface

机译:MOSFET Si / SiO {sub} 2接口中与空穴能量有关的接口陷阱产生

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The nature and composition of generated interface-trap (ΔN{sub}(IT)) in p-MOSFETs is studied as a function of hole energy. By observing the time dependence of generation during stress and the amount pf recovery after stress, it is shown that ΔN{sub}(IT) is due to both broken ≡Si-H and ≡Si-O- bonds, their ratio governed by hole energy. In the absence of hot holes ΔN{sub}(IT) is primarily composed of broken ≡Si-H, which show a lower power-law time exponent and a fraction of which anneal after stress. Additional ΔN{sub}(IT) is created in the presence of hot holes, which is due to broken ≡Si-O- bonds. These traps show a much larger power-law time exponent, and they do not anneal after stress. These observations have important implications for lifetime prediction under negative bias temperature instability, Fowler-Nordheim, and hot carrier injection stress conditions.
机译:研究p-MOSFET中产生的界面陷阱(ΔN{sub}(IT))的性质和组成与空穴能量的关系。通过观察应力产生的时间依赖性和应力后的pf恢复量,可以看出ΔN{sub}(IT)是由于toSi-H和≡Si-O-键断裂所致,它们的比值受孔的控制能源。在没有热孔的情况下,ΔN{sub}(IT)主要由断裂的≡Si-H组成,这显示出较低的幂律时间指数,并且其中一部分在应力作用下退火。由于存在≡Si-O-键断裂,在存在热孔的情况下会产生其他ΔN{sub}(IT)。这些陷阱显示出更大的幂律时间指数,并且在受压后不会退火。这些观察结果对负偏压温度不稳定性,Fowler-Nordheim和热载流子注入应力条件下的寿命预测具有重要意义。

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