Metal-Core Printed Circuit Board With Alumina Layer by Aerosol Deposition Process

摘要

Heat dissipation properties of metal-core printed circuit boards (MCPCBs) having a ceramic dielectric layer are presented for high-power light-emitting diodes (LEDs). The proposed MCPCB is composed of a dense alumina thin film on an aluminum plate, instead of the conventional MCPCB with ceramic polymer composite, which shows low thermal conductivity. Dense alumina thin films, deposited by an aerosol deposition process, showed low leakage current and good dielectric breakdown for high-power applications. Thermal transient measurements of LEDs with the proposed MCPCB were compared to that of LEDs with conventional MCPCB. The MCPCBs proposed here showed better heat dissipation performance and lower thermal resistance.