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Ferroelectric Thin-Film Capacitors for Flexible Nonvolatile Memory Applications

机译:用于柔性非易失性存储应用的铁电薄膜电容器

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This letter reports the fabrication of $hbox{PbZr}_{x}hbox{Ti}_{1-x} hbox{O}_{3}$ (PZT) thin-film capacitors on flexible plastic substrates. The PZT film was formed on a wafer using a sol–gel method and transferred to a thin plastic substrate using an elastomeric stamp. The PZT film on the plastic substrate showed a well-saturated hysteresis loop with a $P_{r}$ of $sim!hbox{20} muhbox{C}/hbox{cm}^{2}$ and a $V_{c}$ of $ sim$1.1 V at a supplied voltage of 3 V, which are similar to those observed for PZT films on rigid wafers, as well as stable operation under an 8-mm bending radius. These characteristics suggest promising applications in flexible electronic systems.
机译:这封信报道了在柔性塑料基板上制造$ hbox {PbZr} _ {x} hbox {Ti} _ {1-x} hbox {O} _ {3} $(PZT)薄膜电容器的过程。使用溶胶-凝胶法在晶片上形成PZT膜,然后使用弹性体压模将其转移到薄塑料基板上。塑料基板上的PZT膜显示出饱和磁滞回线,其中$ P_ {r} $ $ sim!hbox {20} muhbox {C} / hbox {cm} ^ {2} $和$ V_ {c } $ sim $ 1.1 V,在3 V的供电电压下,类似于在刚性晶片上的PZT膜所观察到的电压,以及在8毫米弯曲半径下的稳定操作。这些特征表明在柔性电子系统中有希望的应用。

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