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Horizontal Current Bipolar Transistor With a Single Polysilicon Region for Improved High-Frequency Performance of BiCMOS ICs

机译:具有单个多晶硅区域的水平电流双极晶体管可改善BiCMOS IC的高频性能

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A new horizontal current bipolar transistor (HCBT) with a single polysilicon region and a CMOS gate polysilicon near the $hbox{n}^{+}$ emitter region is integrated with CMOS technology with the addition of two or three masks (three or four masking steps) and a small number of additional fabrication steps. The single-poly HCBT with an optimized collector exhibits $f_{T}$ and $f_{max}$ of 51 and 61 GHz, respectively, and an $f_{T}BV_{rm CEO}$ product of 173 $hbox{GHz} cdot hbox{V}$, which are the best reported HCBT characteristics to date and among the highest performance Si BJTs. An HCBT with only two additional masks to CMOS has $f_{T}$ and $f_{max}$ of 43 and 53 GHz, respectively, and an $f_{T}BV_{rm CEO}$ product of 120 $hbox{GHz} cdot hbox{V}$. The developed innovative fabrication techniques enable a very low-cost BiCMOS platform for wireless communication circuits.
机译:新的水平电流双极晶体管(HCBT)具有单个多晶硅区域和在$ hbox {n} ^ {+} $发射极区域附近的CMOS栅极多晶硅与CMOS技术集成在一起,并增加了两个或三个掩模(三个或四个)掩膜步骤)和少量其他制造步骤。具有优化的集电极的单晶HCBT分别具有51 GHz和61 GHz的$ f_ {T} $和$ f_ {max} $,以及$ 173的$ f_ {T} BV_ {rm CEO} $产品$ hbox { GHz} cdot hbox {V} $,这是迄今为止报道得最好的HCBT特性,也是性能最高的Si BJT之一。仅具有CMOS附加两个掩模的HCBT的$ f_ {T} $和$ f_ {max} $分别为43 GHz和53 GHz,以及$ f_ {T} BV_ {rm CEO} $乘积为120 $ hbox { GHz} cdot hbox {V} $。开发的创新制造技术为无线通信电路提供了一种非常低成本的BiCMOS平台。

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