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High-Performance Polycrystalline Silicon TFT on the Structure of a Dopant-Segregated Schottky-Barrier Source/Drain

机译:掺杂物隔离的肖特基势垒源极/漏极结构上的高性能多晶硅TFT

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摘要

A high-performance polycrystalline silicon (poly-Si) thin-film transistor (TFT) with Schottky-barrier (SB) source/drain (S/D) junctions is proposed. A p-channel operation on the intrinsic nickel (Ni) silicided S/D was successfully realized with the aid of a thin active layer, despite the fact that the Ni silicided material shows a high SB height (SBH) for holes. Furthermore, for n-channel operation, the dopant-segregation technique implemented on the intrinsic Ni silicide was utilized to reduce the effective SBH for electrons. The results show a higher on-current due to the lower parasitic resistance as well as superior immunity against short-channel effects, compared to the conventional poly-Si TFT composed of p-n S/D junctions.
机译:提出了一种具有肖特基势垒(SB)源/漏(S / D)结的高性能多晶硅薄膜晶体管(TFT)。尽管硅化镍材料对孔显示出较高的SB高度(SBH),但借助薄的有源层,已成功实现了对本征硅化镍(Ni)的S / D的p沟道操作。此外,对于n沟道操作,利用在本征Ni硅化物上实施的掺杂剂离析技术可降低电子的有效SBH。结果表明,与由p-n S / D结组成的常规多晶硅TFT相比,由于较低的寄生电阻以及出色的抗短沟道效应,其导通电流更高。

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