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150-GHz RF SOI-CMOS Technology in Ultrathin Regime on Organic Substrate

机译:超薄型有机衬底上的150 GHz RF SOI-CMOS技术

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This letter provides an experimental demonstration of high-performance industrial MOSFETs thinned down to 5.7 $muhbox{m}$ and transferred onto a 125- $muhbox{m}$-thick polyethylene naphthalate foil. The die stack transferred onto the organic substrate comprises the 200-nm-thick active layer and the 5.5- $muhbox{m}$-thick interconnection multilayer stack resulting in a light, compact, and bendable thin film. We unveil that dc and RF performances are invariant even for ultimate thinning down to the buried oxide layer. Furthermore, n-MOSFET performance is improved by $hbox{1.5}times$ compared with previous work, and the first demonstration of 100-GHz p-MOSFETs on an organic substrate is presented. Unity-current-gain cutoff and maximum oscillation frequencies as high as 150/160 GHz for n-MOSFETs and 100/130 GHz for p-MOSFETs on a plastic substrate have been measured, respectively.
机译:这封信提供了一个实验性的演示,演示了将高性能工业MOSFET减薄至5.7μmHbox{m} $并转移到125-μμmhbox{m} $厚的聚萘二甲酸乙二醇酯箔上的过程。转移到有机基板上的管芯堆叠包括200纳米厚的有源层和5.5微米级的互连多层堆叠,从而形成了轻巧,紧凑且可弯曲的薄膜。我们揭露,即使最终薄化到掩埋的氧化物层,直流和射频性能也不会改变。此外,与以前的工作相比,n-MOSFET的性能提高了$ hbox {1.5}倍,并且首次展示了在有机衬底上的100 GHz p-MOSFET。在塑料基板上,n-MOSFET的单位电流增益截止和最大振荡频率分别高达150/160 GHz和p-MOSFET的最大振荡频率高达100/130 GHz。

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