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首页> 外文期刊>Electron Device Letters, IEEE >Fabrication of 150-nm T-Gate Metamorphic AlInAs/GaInAs HEMTs on GaAs Substrates by MOCVD
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Fabrication of 150-nm T-Gate Metamorphic AlInAs/GaInAs HEMTs on GaAs Substrates by MOCVD

机译:通过MOCVD在GaAs衬底上制备150nm T-Gate变质AlInAs / GaInAs HEMTs

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摘要

Metamorphic AlInAs/GaInAs high-electron-mobility transistors (HEMTs) of 150-nm gate length with very good device performance have been grown by metal–organic chemical vapor deposition, with the introduction of an effective multistage buffering scheme. By using a combined optical and e-beam photolithography technology, submicrometer mHEMT devices have been achieved. The devices exhibit good dc and RF performance. The maximum transconductance was 1074 mS/mm. The nonalloyed ohmic contact resistance $R_{c}$ was as low as 0.02 $Omega cdot hbox{mm}$. The unity current gain cutoff frequency $(f_{T})$ and the maximum oscillation frequency $(f_{max})$ were 279 and 231 GHz, respectively. This device has the highest $f_{T}$ yet reported for 150-nm gate-length HEMTs. Also, an input capacitance to gate–drain feedback capacitance ratio $C_{rm gs}/C_{rm gd}$ of 3.2 is obtained in the device.
机译:通过有机金属化学气相沉积技术以及有效的多级缓冲方案的引入,已经开发出了栅极长度为150 nm且具有非常好的器件性能的变质AlInAs / GaInAs高电子迁移率晶体管(HEMT)。通过结合使用光学和电子束光刻技术,已实现了亚微米mHEMT器件。该器件具有良好的直流和射频性能。最大跨导为1074 mS / mm。非合金欧姆接触电阻$ R_ {c} $低至0.02 $Ωcbox hmm {mm} $。单位电流增益截止频率$(f_ {T})$和最大振荡频率$(f_ {max})$分别为279 GHz和231 GHz。该器件的$ f_ {T} $最高,据报道是150纳米栅极长度的HEMT。而且,在该器件中获得了3.2的输入电容与栅漏反馈电容之比$ C_ {rm gs} / C_ {rm gd} $。

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