首页> 外文期刊>Electron Device Letters, IEEE >Drain-Induced Barrier Lowering in Short-Channel Poly-Si TFT After Off-Bias Stress Using Metal-Induced Crystallization of Amorphous Silicon
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Drain-Induced Barrier Lowering in Short-Channel Poly-Si TFT After Off-Bias Stress Using Metal-Induced Crystallization of Amorphous Silicon

机译:利用非晶硅的金属诱导结晶,在偏置应力之后,短沟道多晶硅TFT中的漏极诱导势垒降低

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We report the effect of off-bias stress on the transfer characteristics of short-channel $(L = hbox{0.95} muhbox{m})$ low-temperature polycrystalline silicon (poly-Si) thin-film transistor (TFT). The poly-Si TFT using metal-mediated crystallization of a-Si exhibited a field-effect mobility of 93.07 $hbox{cm}^{2}/hbox{V}cdothbox{s}$ . In addition to the reduction of off-state leakage currents, threshold voltage shifts of 2.28 and 3.45 V were observed after off-bias stress at the drain voltages of $-$0.1 V and $-$ 1 V, respectively. This is attributed to the reduction of the effective channel length and to drain-induced barrier lowering effect, which lead to different current–voltage characteristics when the source/drain electrodes are exchanged.
机译:我们报告偏偏置应力对短沟道$(L = hbox {0.95} muhbox {m})$低温多晶硅(poly-Si)薄膜晶体管(TFT)的传输特性的影响。使用金属介导的a-Si结晶的多晶硅TFT表现出93.07 $ hbox {cm} ^ {2} / hbox {V} cdboxbox {s} $的场效应迁移率。除了减少关态漏电流外,在漏极电压分别为$-$ 0.1 V和$-$ 1 V的偏置电压后,观察到阈值电压偏移为2.28 V和3.45V。这归因于有效沟道长度的减少和漏极引起的势垒降低效应,当更换源极/漏极时,会导致不同的电流-电压特性。

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