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Optimization of 40-nm Node Epitaxial Diode Array for Phase-Change Memory Application

机译:用于相变存储应用的40nm节点外延二极管阵列的优化

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A numerical model of an epitaxial (EPI) diode array for next-generation memory device application, including phase-change memory, has been presented. According to a diode array process scheme and technology computer-aided design (TCAD) simulation results, a quasi-physical model with a buried $ hbox{n}^{+}$ layer dosage, EPI layer thickness, and breakdown voltage (BVD) correlation is proposed to improve electrical performance. From the optimal silicon-based results, a 16 $ times$ 16 diode array shows a drive current density of $sim!! hbox{56.6} hbox{mA}/muhbox{m}^{2}$, a BVD of $sim$ 8 V, a $J_{rm on}/J_{rm off}$ ratio of $sim!!hbox{10}^{9}$, and crosstalk immunity. Additionally, this calibrated physical model can be applied in the next generation of silicon-based fabrication with parameters extraction.
机译:已经提出了用于下一代存储设备应用(包括相变存储器)的外延(EPI)二极管阵列的数值模型。根据二极管阵列工艺方案和技术计算机辅助设计(TCAD)仿真结果,具有掩埋$ hbox {n} ^ {+} $层剂量,EPI层厚度和击穿电压(BVD)的准物理模型提出了相关性以改善电气性能。从基于硅的最佳结果来看,一个16 x 16的二极管阵列显示的驱动电流密度为sim !!! hbox {56.6} hbox {mA} / muhbox {m} ^ {2} $,BVD为$ sim $ 8 V,$ J_ {rm on} / J_ {rm off} $比率为$ sim !! hbox { 10} ^ {9} $和串扰抗扰度。此外,这种经过校准的物理模型可以在具有参数提取功能的下一代基于硅的制造中应用。

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