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首页> 外文期刊>Electron Device Letters, IEEE >Fabrication of 100-nm Metamorphic AlInAs/GaInAs HEMTs Grown on Si Substrates by MOCVD
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Fabrication of 100-nm Metamorphic AlInAs/GaInAs HEMTs Grown on Si Substrates by MOCVD

机译:利用MOCVD法制备Si衬底上生长的100 nm变质AlInAs / GaInAs HEMT

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摘要

High-performance metamorphic $hbox{Al}_{0.49}hbox{In}_{0.51}hbox{As-/} breakhbox{Ga}_{0.47-}hbox{In}_{0.53}hbox{As}$ high-electron-mobility transistors (mHEMTs) grown on Si substrates by metal–organic chemical vapor deposition (MOCVD) using an effective multistage composite buffer scheme have been fabricated. Room-temperature Hall measurements show an average sheet carrier density of $hbox{4.5} times hbox{10}^{12} hbox{cm}^{-2}$ with a mobility of over 7500 $hbox{cm}^{2}/hbox{V}cdot hbox{s}$. Maximum transconductance of mHEMTs with a 100-nm gate length was $sim$ 770 mS/mm, which is nearly the same as that of mHEMTs with the same dimension grown on GaAs substrates by MOCVD. The unity current gain cutoff frequency $(f_{T})$ and the maximum oscillation frequency $(f_{rm max})$ were 210 and 146 GHz, respectively. To our best knowledge, these results are the best reported for MOCVD-grown mHEMTs on Si.
机译:高性能变形$ hbox {Al} _ {0.49} hbox {In} _ {0.51} hbox {As- /} breakhbox {Ga} _ {0.47-} hbox {In} _ {0.53} hbox {As} $高通过有效的多级复合缓冲方案,通过金属有机化学气相沉积(MOCVD)在硅衬底上生长的电子迁移晶体管(mHEMT)得以制造。室温霍尔测量显示,平均薄片载体密度为$ hbox {4.5}乘以hbox {10} ^ {12} hbox {cm} ^ {-2} $,迁移率超过7500 $ hbox {cm} ^ {2 } / hbox {V} cdot hbox {s} $。栅极长度为100 nm的mHEMT的最大跨导为770 mS / mm,约为770 mS / mm,与通过MOCVD在GaAs衬底上生长的相同尺寸的mHEMT的最大跨导相同。单位电流增益截止频率$(f_ {T})$和最大振荡频率$(f_ {rm max})$分别为210 GHz和146 GHz。据我们所知,这些结果是在Si上MOCVD生长的mHEMT上报道得最好的。

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