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首页> 外文期刊>IEEE Electron Device Letters >Trench Multiple Floating Limiting Rings Termination for 4H-SiC High-Voltage Devices
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Trench Multiple Floating Limiting Rings Termination for 4H-SiC High-Voltage Devices

机译:用于4H-SiC高压器件的沟槽式多个浮动限流环终端

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摘要

A junction termination method adopting heavily doped p-well rings with a shallow trench for each ring, named as a trench multiple floating limiting rings (TMFLRs), is analyzed and fabricated without any additional process in 4H-SiC junction barrier Schottky diode. A breakdown voltage of 6.7 kV is achieved using TMFLRs structure on an epitaxial layer with thickness of 50 μm, while the breakdown voltage of the conventional planar FLRs structure with the same termination area is only 5.7 kV. The experimental result has demonstrated that the TMFLRs termination structure yields about 90% of the parallel plane breakdown voltage. In addition, the simulation results show that the TMFLRs make the bulk peak electric field (Epbulk) reduce and move away from the device surface, successfully making the interface peak electric field (Ep,interface) decrease by about 30% compared with a conventional planar FLRs structure when same reverse voltages applied.
机译:在4H-SiC结势垒肖特基二极管中,无需进行任何额外处理,就可以分析和制造一种结终止方法,该结终止方法采用重掺杂的p阱环,每个环具有浅沟槽,该沟槽被称为沟槽多个浮动限制环(TMFLR)。使用TMFLRs结构在厚度为50μm的外延层上实现6.7 kV的击穿电压,而具有相同端接面积的常规平面FLRs结构的击穿电压仅为5.7 kV。实验结果表明,TMFLR的端接结构可产生约90%的平行平面击穿电压。此外,仿真结果表明,TMFLR使整体峰值电场(Epbulk)减小并远离器件表面,与传统平面相比,成功地使界面峰值电场(Ep,interface)降低了约30%。当施加相同的反向电压时,FLR构成。

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