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900 V Reverse-Blocking GaN-on-Si MOSHEMTs With a Hybrid Tri-Anode Schottky Drain

机译:具有混合三阳极肖特基漏极的900 V反向阻挡GaN-on-Si MOSHEMT

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In this letter, we present high-performance GaN-on-Si metal-oxide-semiconductor high electron mobility transistors with record reverse-blocking (RB) capability. By replacing the conventional ohmic drain with a hybrid tri-anode Schottky drain, a high reverse breakdown voltage (VBR) of -900 V was achieved (at 1 μA/mm with grounded substrate), along with a small reverse leakage current (IR) of ~20 nA/mm at -750 V. The devices also presented a small turn-ON voltage (VON) of 0.58 ± 0.02 V, a small increase in forward voltage (ΔFV) of ~0.8 V, a high ON/OFF ratio over 1010, and a high forward breakdown voltage (VBF) of 800 V at 20 nA/mm with grounded substrate. These results demonstrate a new milestone for RB GaN transistors, and open enormous opportunities for integrated GaN power devices.
机译:在这封信中,我们介绍了具有记录反向阻挡(RB)功能的高性能GaN-on-Si金属氧化物半导体高电子迁移率晶体管。通过用混合三阳极肖特基漏极代替传统的欧姆漏极,可实现-900 V的高反向击穿电压(V B R )(在1μA/毫米(带接地基板),以及在-750 V时约〜20 nA / mm的反向反向漏电流(I R )。该器件还具有较小的开启电压(V ON 为0.58±0.02 V,正向电压(Δ F V )的小幅增加为〜0.8 V,超过10时的高ON / OFF比 10 ,并在接地的情况下以20 nA / mm的高正向击穿电压(V B F )800V。这些结果证明了RB GaN晶体管的新里程碑,并为集成GaN功率器件打开了巨大机遇。

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