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High-Voltage and Low-Leakage AlGaN/GaN Tri-Anode Schottky Diodes With Integrated Tri-Gate Transistors

机译:具有集成三栅晶体管的高压低泄漏AlGaN / GaN三阳极肖特基二极管

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摘要

We present AlGaN/GaN nanostructured Schottky barrier diodes (SBDs) on silicon substrate with high breakdown voltage (VBR) and low reverse leakage current (IR), based on a hybrid of tri-anode and tri-gate architectures. The fabricated SBDs presented a small turn-ON voltage (VON) of 0.76 ± 0.05 V, since the trianode architecture formed direct Schottky contact to the 2-D electron gas (2DEG). The reverse characteristic was controlled electrostatically by an embedded tri-gate transistor, instead of relying only on the Schottky barrier. This resulted in low IR below 10 and 100 nA/mm at large reverse biases up to 500 and 700 V, respectively. In addition, these devices exhibited record VBR up to 1325 V at IR of 1 μA/mm, rendering an excellent high-power figure-of-merit (FOM) of 939 MW/cm2 and demonstrating the significant potential of nanostructured GaN SBDs for future efficient power conversion.
机译:我们基于三阳极和三栅架构的混合结构,在硅衬底上展示具有高击穿电压(VBR)和低反向漏电流(IR)的AlGaN / GaN纳米肖特基势垒二极管(SBD)。所制造的SBD具有0.76±0.05 V的小接通电压(VON),因为三阳极体系结构形成了与2D电子气(2DEG)的直接肖特基接触。反向特性由嵌入式三栅晶体管静电控制,而不是仅依靠肖特基势垒。这导致分别在高达500 V和700 V的大反向偏置下,IR低于10和100 nA / mm。此外,这些器件在1μA/ mm的IR下具有高达1325 V的VBR记录,从而提供了939 MW / cm2的出色高功率品质因数(FOM),并证明了纳米结构GaN SBD的巨大潜力高效的电源转换。

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