首页> 外文期刊>Electron Device Letters, IEEE >A 650 V Super-Junction MOSFET With Novel Hexagonal Structure for Superior Static Performance and High BV Resilience to Charge Imbalance: A TCAD Simulation Study
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A 650 V Super-Junction MOSFET With Novel Hexagonal Structure for Superior Static Performance and High BV Resilience to Charge Imbalance: A TCAD Simulation Study

机译:具有新型六边形结构的650 V超结MOSFET,具有出色的静态性能和高BV弹性以应对电荷不平衡:TCAD仿真研究

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摘要

A superjunction MOSFET (SJ-MOSFET) with a new fully close-packed hexagonal pattern for its superjunction (SJ) region is proposed. According to TCAD simulation, the proposed device can accommodate highly doped n-pillars with no significant degradation of its blocking voltage (BV), where its conventional counterpart, a SJ-MOSFET with a stripe-patterned SJ region is incapable of. In comparison with the conventional device, the proposed device shows dramatic reduction of ON-resistance down by 41% while keeping its BV of 650 V. The proposed device also shows superior BV resilience to charge imbalance than the conventional device.
机译:提出了一种超结MOSFET(SJ-MOSFET),其超结(SJ)区域具有新的完全密排六边形图案。根据TCAD仿真,所提出的器件可以容纳高掺杂的n柱,而不会显着降低其阻断电压(BV),而传统的同类产品SJ-MOSFET却无法实现,该SJ-MOSFET具有条形SJ区域。与常规装置相比,所提出的装置显示出导通电阻降低了41%,同时保持其BV为650V。与常规装置相比,所提出的装置还显示出优异的BV弹性以防止电荷不平衡。

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