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N-Polar GaN-on-Sapphire Deep Recess HEMTs With High W-Band Power Density

机译:N极GaN-On-Sapphire深凹槽,具有高W波段功率密度

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This work presents recent progress in the W-band (94 GHz) power performance of N-polar GaN deep recess HEMTs grown on sapphire substrates. While SiC has been the substrate of choice to achieve the highest level of performance, sapphire substrates are a lower cost alternative. In this work we show that N-polar GaN deep recess HEMTs grown on sapphire match the power performance of a device on SiC up to 14 V with 5.1 W/mm of output power density. At 16 V the device on sapphire starts to suffer from thermal effects but still demonstrated 5.5 W/mm with an associated 20.6% power-added efficiency. This work also examines the impact of encapsulating the device in a low dielectric constant film often used for the implementation of a RF wiring environment.
机译:这项工作介绍了在蓝宝石基板上生长的N极GaN深凹槽垫的W波段(94GHz)功率性能的进展。虽然SiC是实现最高性能水平的选择基板,但是蓝宝石基板是较低的成本替代品。在这项工作中,我们展示了在Sapphire上生长的N极GaN深度凹陷HEMTS在SIC上的功率性能,最高可达14 V,输出功率密度为5.1W / mm。在16 V时,Sapphire上的设备开始遭受热效应,但仍然展示了5.5W / mm,具有相关的20.6%的电力增加的效率。这项工作还研究了将设备封装在低介电常数膜中的影响,该膜通常用于实现RF布线环境的实施方式。

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