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Densification Control as a Method of Improving the Ambient Stability of Sol–Gel-Processed SnO2 Thin-Film Transistors

机译:致密化控制作为提高Sol-Gel处理的SnO 2 薄膜晶体管环境稳定性的一种方法

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We use sol-gel-processed SnO2 to fabricate thin-film transistors (TFTs) with good ambient stability, showing that SnO2 film densification can be effectively controlled by a choice of proper drying temperatures. In particular, TFTs comprising SnO2 films dried at 150 degrees C show conventional n-type semiconductor properties, high-saturation-regime field-effect mobility (7.3 cm(2)/Vs), good on/off current ratio, excellent sub-threshold swing values, and good electrical stability after 30-day exposure to ambient air, which alleviates the need for additional passivation layers to protect the active channel layer. Conversely, TFTs comprising SnO2 films dried at 50 or 100 degrees C show poor environmental stability due to low densification. Specifically, less dense films are characterized by the presence of loosely packed structures and small contact areas between crystallites, which promote the adsorption of gas molecules from the surroundings and result in significant TFT performance deterioration.
机译:我们使用溶胶-凝胶处理的SnO2来制造具有良好环境稳定性的薄膜晶体管(TFT),这表明SnO2薄膜的致密化可以通过选择合适的干燥温度来有效控制。特别是,包含在150摄氏度下干燥的SnO2薄膜的TFT表现出常规的n型半导体特性,高饱和度场效应迁移率(7.3 cm(2)/ Vs),良好的开/关电流比,出色的亚阈值摆动值以及在暴露于环境空气30天后的良好电稳定性,从而减轻了对附加钝化层以保护有源通道层的需求。相反,由于低致密性,包含在50或100摄氏度下干燥的SnO2薄膜的TFT表现出较差的环境稳定性。具体而言,密度较小的薄膜的特征在于存在松散堆积的结构和微晶之间的小接触区域,这会促进气体分子从周围环境中吸附并导致TFT性能显着下降。

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