首页> 外文期刊>AIP Advances >Low-temperature (200 oC) solid-phase crystallization of high substitutional Sn concentration (~10%) GeSn on insulator enhanced by weak laser irradiation
【24h】

Low-temperature (200 oC) solid-phase crystallization of high substitutional Sn concentration (~10%) GeSn on insulator enhanced by weak laser irradiation

机译:通过弱激光照射,低温(<200℃)高取代Sn浓度(约10%)Gesn的固相结晶(〜10%)GESN增强

获取原文
           

摘要

Low temperature (200 supo/supC) crystallization of GeSn (substitutional Sn concentration: 8%) on insulating substrates is essential to realize next generation flexible electronics. To achieve this, a growth method of high quality GeSn films on insulating substrates by combination of laser irradiation and subsequent thermal annealing is developed. Here, the laser fluence is chosen as weak, which is below the critical fluence for crystallization of GeSn. It is clarified that for samples irradiated with weak laser fluence, complete crystallization of GeSn films is achieved by subsequent thermal annealing at ~170 supo/supC without incubation time. In addition, the quality of GeSn films obtained by this method is higher compared with conventional growth techniques such as melting growth by pulsed laser annealing or solid-phase crystallization (SPC) without pre-laser irradiation. Substitutional Sn concentrations in the grown layers estimated by Raman spectroscopy measurements are 8-10%, which far exceed thermal equilibrium solid-solubility of Sn in Ge (~2%). These phenomena are explained by generation of a limited number of nuclei by weak laser irradiation and lateral SPC by subsequent thermal annealing. This method will facilitate realization of next-generation high performance devices on flexible insulating substrates.
机译:在绝缘基板上的GESN(取代Sn浓度:8%)的低温(<200 O c)结晶对于实现下一代柔性电子器件是必不可少的。为实现这一点,开发了通过激光照射和随后的热退火组合的绝缘基板上的高质量GESN膜的生长方法。这里,选择激光流量较弱,低于Gesn结晶的临界流量。澄清,对于用弱激光物流量照射的样品,通过在〜170 O C的后续热退火而没有温育时间来实现GESN膜的完全结晶。另外,通过该方法获得的GESN薄膜的质量与常规生长技术相比较高,例如通过脉冲激光退火或固相结晶(SPC)的熔化生长而没有预激光照射。由拉曼光谱测量估计的生长层中的取代Sn浓度为8-10%,远远超过Ge(〜2%)的Sn的热平衡固体溶解度。通过通过随后的热退火通过弱激光照射和横向SPC产生有限数量的核来解释这些现象。该方法将促进在柔性绝缘基板上实现下一代高性能装置。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号