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Roles of Atomic Nitrogen/Hydrogen in GaN Film Growth by Chemically Assisted Sputtering with Dual Plasma Sources

机译:用双等离子体源化学辅助溅射在GaN膜生长中的原子氮/氢的作用

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The growth of sputtered GaN at low temperature is strongly desired to realize the dissemination of low-cost GaN high electron mobility transistor devices for next-generation communication technology. In this work, the roles of atomic nitrogen (N)/hydrogen (H) in GaN film growth on AlN/sapphire substrates by chemically assisted dual source sputtering are studied at a low growth temperature of 600 °C under a pressure of 2 Pa using vacuum ultraviolet absorption spectroscopy. The lateral growth was strongly enhanced with an appropriate H/N flux ratio of 1.9 at a GaN growth rate of ~1 μm h~(–1). X-ray photoelectron spectroscopy measurements indicated that N removal from the grown GaN surface by atomic hydrogen promoted the migration of Ga. A smooth GaN surface was achieved at a suitable N/Ga supply ratio of 53 and a H/N ratio of 1.9 with the addition of 0.5% chlorine to the Ar sputtering gas.
机译:强烈希望在低温下溅射GaN的生长来实现用于下一代通信技术的低成本GaN高电子迁移率晶体管器件的传播。在这项工作中,通过化学辅助的双源溅射在600℃的低生长温度下,在2Pa使用的压力下,研究了通过化学辅助双源溅射对ALN / Sapphire衬底上的GaN / Sapphire底物上的GaN膜生长的作用真空紫外线吸收光谱。在GaN生长速率为〜1μmH〜(-1)的GaN生长速率下,用适当的H / N焊剂比强烈地增强了横向生长。 X射线光电子能谱测量结果表明,通过原子氢从生长的GaN表面上除去促进Ga的迁移。以合适的n / ga供应比为53和h / n比为1.9的比例实现了光滑的GaN表面。向AR溅射气体加入0.5%氯。

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