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Piezoresistive temperature sensors fabricated by a surface micromachining CMOS MEMS process

机译:压阻温度传感器由表面微机械加工CMOS MEMS工艺制造

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This paper presents a micromachined monocrystalline silicon piezoresistive temperature sensor fabricated by a surface micromachining CMOS (Complementary Metal Oxide Semiconductor) MEMS (Micro-Electro-Mechanical System) process. The design of the temperature sensor is based on the structure of the multi-layer cantilever beam and the bimetallic effect. The temperature change of the cantilever beam is translated into the change of the piezoresistance’s value. The test results show that the sensitivities of the sensors are 27.9 mV/°C with 100 Ω/? piezoresistance between ?40?°C to 60?°C and 7.4 mV/°C with 400 Ω/? piezoresistance between ?90?°C to 60?°C. The temperature sensor proposed in this paper can be used in radiosondes for its low operating temperature (as low as ?90?°C), small size (below 1 mm2) and low heat capacity.
机译:本文介绍了由表面微机械加工CMOS(互补金属氧化物半导体)MEMS(微机电系统)工艺制造的微机械型单晶硅压阻温度传感器。温度传感器的设计基于多层悬臂梁和双金属效果的结构。悬臂梁的温度变化转换为压阻值的变化。测试结果表明,传感器的敏感度为27.9 mV /°C,100Ω/□在400Ω/°C和7.4 mV /°C之间的压阻率在90?°C至60°C之间的压阻率。本文提出的温度传感器可用于可无线电盘,其低操作温度(低至90°C),小尺寸(低于1mm2)和低热容量。

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