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首页> 外文期刊>Journal of nuclear science and technology >Prediction Method for Total Dose Effects on Complementary Metal Oxide Semiconductor Integrated Circuits
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Prediction Method for Total Dose Effects on Complementary Metal Oxide Semiconductor Integrated Circuits

机译:互补金属氧化物半导体集成电路总剂量效应的预测方法

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A method is described to predict radiation hardness of general purpose logic ICs using device parameters measured by total dose testing of "elemental ICs" selected from an IC family. The total dose degradation on ICs can be predicted by simulations using their back-fitted device parameter shift data and circuits data. This method was applied to CMOS logic ICs of the HD74HC series. The HD74HC04 inverter was selected as the elemental IC, and irradiated up to 300 Gy to determine the threshold voltage shifts of n- and p-channel MOS FETs. Using the back-fitted threshold voltage shifts of the n- and p-channels, the degradation of the static characteristic and propagation delay time of the HD74HCO4 were predicted up to a large total dose, 2, 000 Gy, at functional failure.
机译:描述了一种方法,该方法使用通过对选自IC系列的“元素IC”进行总剂量测试而测得的器件参数来预测通用逻辑IC的辐射硬度。 IC的总剂量降低可以通过使用其后装器件参数偏移数据和电路数据进行仿真来预测。该方法已应用于HD74HC系列的CMOS逻辑IC。选择HD74HC04反相器作为基本IC,并对其进行高达300 Gy的辐照以确定n和p沟道MOS FET的阈值电压漂移。使用n通道和p通道的后向拟合阈值电压偏移,可以预测功能失效时,HD74HCO4的静态特性的劣化和传播延迟时间将达到大的总剂量2,000 Gy。

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