Dependence of De-molding Force on Process Conditions in UV Nanoimprint

摘要

The de-molding force between a UV resist and a Si dioxide surface is measured for various UV light intensities and exposure times. Typical UV radical polymerization resists are examined without any surface treatment of the Si dioxide surface for releasing. The result shows that the de-molding force increases in as increments of the UV light intensity, however it does not depend on the UV dosage. But the de-molding force depends on the product of the square root of the light intensity and exposure time, which is nearly consistent with the UV curing characteristics of the polymer.